Thermally Conductive Adhesive ST922,Heat conduction silica gel STARS-922 Thermal Pads heatsink-ShenZhen MoreSuns Electronics Co.,Ltd

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Thermally Conductive Adhesive ST922,Heat conduction silica gel STARS-922 Thermal Pads heatsink

Thermal conductive adhesive (white paste body);
Coefficient of thermal conductivity>0.671W/m.k;
Breaking strength 1.5MPA
The surface curing time 10MIN/25C

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